LEDitgo TX
The TX Series is designed for permanent indoor installations and stands out for its excellent resolution and impressive performance.
The modules, in the modern 16:9 aspect ratio, allow for popular dimensions such as 3.00 x 1.68 m with a resolution of 3,840 x 2,160 pixels or 6.00 x 3.37 m with 7,680 x 4,320 pixels—all without any scaling. This offers maximum flexibility in the planning and construction of LED walls. Even intermediate formats can be easily implemented with pixel-precise content delivery or through scaling. A wall mounting system is available as an option, enabling simple and secure installation. Additionally, all service can be performed from the front, which simplifies maintenance and the replacement of components.
Product Information
| Module size 600 x 337.5 mm | TX0.7-C/M | TX0.9-C/M | TX1,2-E/C/M | TX1.5-E/C/M | TX1.8-E |
|---|---|---|---|---|---|
| Pixel pitch | 0.7 mm | 0.9 mm | 1.2 mm | 1.5 mm | 1.8 mm |
| Brightness (calibrated) | 1,200 nits | 1,200 nits | 1,200 nits | 1,200 nits | 1,000 nits |
| Resolution | 768 x 432 px | 640 x 360 px | 480 x 270 px | 384 x 216 px | 320 x 180 px |
| Receiving Card | XA50 Pro | XA50 Pro | A10s Pro | A10s Pro | A8s-N |
| Rated Power | typ. 25 W, max. 100 W | typ. 25 W, max. 100 W | typ. 25 W, max. 100 W | typ. 31 W, max. 90 W | typ. 31 W, max. 90 W |
| Power Supply Capacity | 600 W | 600 W | 600 W | 600 W | 600 W |
| Voltage range | AC 210–240 V | 50–60 Hz | AC 210–240 V | 50–60 Hz | AC 210–240 V | 50–60 Hz | AC 210–240 V | 50–60 Hz | AC 210–240 V | 50–60 Hz |
| Power connection | Direct cabling | Direct cabling | Direct cabling | Direct cabling | Direct cabling |
| IP Rating | IP41 | IP41 | IP41 | IP41 | IP41 |
| Weight | 4.8 kg | 4.8 kg | 4.8 kg | 4.8 kg | 4.8 kg |
| Depth | 40 mm | 40 mm | 40 mm | 40 mm | 40 mm |
Differences Between COB and MIP:
COB: With advanced COB (chip on board) technology, the LEDs are soldered directly onto the circuit board and encapsulated with a protective layer. This improves both heat dissipation and energy efficiency and results in a particularly uniform image display.
MIP: MIP (Micro-LED in Package) is a highly advanced technology for integrating extremely small micro-LEDs into a dedicated package before they are mounted on the circuit board. The manufacturing process is considerably more complex than that of COB or conventional SMD. In return, the technology offers a significantly longer LED lifespan and an even better image quality.
